Give a explict value of how much percentage  of the sentence X is disclosed in the innovation information. 

Sentence X :   A device or mechanism can stick, adhere or push a pressing device upward to press the resin.

Below is the innovation information : 

The upper die 28 is provided with a top die clamper 28b around the heated upper die cavity piece 28a at a position below the lower surface of the upper die cavity piece 28a. A recess formed by the upper mold cavity piece 28a and the upper mold clamper 28b becomes an upper mold cavity 28c. The upper mold clamper 28b is provided to be movable up and down with respect to the upper mold cavity piece 28a by being floatingly supported by an upper mold base (not shown) with a spring. Alternatively, a configuration may be adopted in which the upper mold cavity piece 28a is floatingly supported on an upper mold base (not shown) by a spring, and resin pressure is applied by the upper mold cavity piece 28a by this spring. The upper die cavity piece 28a can be provided so as to be moved downward by a movable mechanism using a wedge mechanism (not shown). A device or mechanism can stick, adhere or push a pressing device upward to press the resin. in the workpiece W, the semiconductor chip T adheres to the adhesive sheet S adhered on the carrier plate K, and the liquid resin 5 is supplied to the adhesive surface side of the semiconductor chip T. What is supplied in the part B is placed on the lower clamp surface of the lower mold 30 that has been opened. At this time, sin Write exactly 7 paragraphs each separated with two new lines answering this question. The first paragraph must start with "monitoring".
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