Instruct: Given the title of a scientific paper, retrieve paper titles that are cited by the given paper
Query: Using ultra-low parasitic hybrid packaging method to reduce high frequency EMI noise for SiC power module
A high temperature, double-sided cooling SiC power electronics module
Effects of X Capacitors on EMI Filter Effectiveness
Single chip enabled high frequency link based isolated bias supply for silicon carbide MOSFET six-pack power module gate drives
A SiC JFET driver for a 5 kW, 150 kHz three-phase PWM converter
Conducted EMI simulation of switched mode power supply
A Digitally Controlled Switching Regulator With Reduced Conductive EMI Spectra
Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation
Demonstration of a 50 kW and 100 kHz SiC high power density converter for aerospace application
Miniaturized lumped-element LTCC quadrature hybrid with harmonics suppression
SiC versus Si—Evaluation of Potentials for Performance Improvement of Inverter and DC–DC Converter Systems by SiC Power Semiconductors
High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package
Research on conformal EMI shielding Cu/Ni layers on package
Circulating currents and CM EMI reduction for interleaved three-phase VSC
Simulation techniques for EMC compliant design of automotive IC chips and modules
A high-power-density, high-speed gate driver for a 10 kV SiC MOSFET module
An improved MATLAB/simulink model of SiC power MOSFETs
Improved Microstrip Filters Using PMC Packaging by Lid of Nails
Attenuation of Conducted EMI Emissions From an Inverter-Driven Motor
Simultaneous Switching Noise in On-Chip CMOS Power Distribution Networks
Study of 3D SiP (system-in-package) module for package-on-package application using multi-layer PCB manufacturing process
Vagal activity is quadratically related to prosocial traits, prosocial emotions, and observer perceptions of prosociality.
The Planar Ultrawideband Modular Antenna (PUMA) Array
The issue of LPWAN technology coexistence in IoT environment
Reliability of Silver Sintering on DBC and DBA Substrates for Power Electronic Applications
Low Power Wide Area Networks: A Survey