Instruct: Given a paper title, retrieve paper titles that are cited by the given paper
Query: The fabrication of transmission line on the glass substrate
First Demonstration of 28 GHz and 39 GHz Transmission Lines and Antennas on Glass Substrates for 5G Modules
300-GHz Microstrip-to-Waveguide Transition on a Polyimide Substrate Integrated with an LTCC Substrate Integrated Waveguide
Non-linear transmission lines for pulse shaping in silicon
Modeling, design, and demonstration of 2.5D glass interposers for 16-channel 28 Gbps signaling applications
Broadband effect of linear tapered transitions between probe pads and GCPW signal lines on-chip
Additive manufacturing of substrate integrated waveguide components
Wideband mm-wave compensated 90° bends for Grounded Coplanar Waveguide and microstrip Transmission Lines on flexible LCP substrates
Transmission line approach of left-handed (LH) materials and microstrip implementation of an artificial LH transmission line
A High Performance Tandem Coupler Using Substrate Integrated Suspended Line Technology
Silicon-on-Glass Dielectric Waveguide—Part II: For THz Applications
Silicon-on-Glass Dielectric Waveguide—Part I: For Millimeter-Wave Integrated Circuits
V-Band Via-Less GCPW-to-Microstrip Transition Designed on PET Flexible Substrate Using Inkjet Printing Technology
Comparison on the coupling between Substrate Integrated Waveguide and microstrip transmission lines for antenna arrays
Air-filled substrate integrated waveguide — A flexible and low loss technological platform
A Review on Substrate Integrated Waveguide and its Microstrip Interconnect
3-D low-loss coplanar waveguide transmission lines in multilayer MMICs
High-Resistivity Silicon Dielectric Ribbon Waveguide for Single-Mode Low-Loss Propagation at F/G-Bands
Ultra broadband transmission line transformers - planar realization principles
Small-reflected substrate integrated waveguide termination with multi-step shape and absorbing material
Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon
2.5D and 3D technology challenges and test vehicle demonstrations
Design, Control, and Analysis of a Fault-Tolerant Soft-Switching DC–DC Converter for High-Power High-Voltage Applications
Student attendance system in classroom using face recognition technique
An 8.5-Gb/s Fully Integrated CMOS Optoelectronic Receiver Using Slope-Detection Adaptive Equalizer
Evaluation of SiC MOSFETs for a high efficiency three-phase buck rectifier