Instruct: Given a scientific paper title, retrieve paper titles that are cited by the given paper.
Query: 14 nm chip package interaction development with Cu pillar bump flip chip package
copper pillar shape and related stress simulation studies in flip chip packages .
Recent advances in modeling the underfill process in flip-chip packaging
Advanced flip chip package on package technology for mobile applications
Thermo-compression bonding for 2.5D fine pitch copper pillar bump interconnections on TSV interposer
Nanoparticle assembly and sintering towards all-copper flip chip interconnects
RF Characterization and Modeling of 10 µm Fine-Pitch Cu-Pillar on a High Density Silicon Interposer
Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package
Development of large die fine pitch flip chip BGA using TCNCP technology
Development of Next Generation Flip Chip Interconnection Technology Using Homogenized Laser-Assisted Bonding
New Ultra Thin Chip Scale Package (CSP) based on Thermo-Sonic Flip-Chip Interconnection
Chip package interaction (CPI) reliability of Cu/low-k/ultra-low-k interconnect
Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies
Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering
Methods of underfill flow voids detection and minimization in flip chip package
Ultra-fine pitch Cu-Cu bonding of 6μm bump pitch for 2.5D application
Development of Chip-to-Wafer (C2W) bonding process for high density I/Os Fan-Out Wafer Level Package (FOWLP)
Laser Assisted Bonding Technology Enabling Fine Bump Pitch in Flip Chip Package Assembly
Design, Fabrication, and Characterization of Novel Vertical Coaxial Transitions for Flip-Chip Interconnects
Chip-to-Wafer (C2W) flip chip bonding for 2.5D high density interconnection on TSV free interposer
Development and electrical investigation of novel fine-pitch Cu/Sn pad bumping using ultra- thin buffer layer technique in 3D integration
Active nonrigid ICP algorithm
E-commerce customer churn prediction based on improved SMOTE and AdaBoost
Anhedonia After a Selective Bilateral Lesion of the Globus Pallidus
Strain gauge sensors based on thermoplastic nanocomposite for monitoring inflatable structures
Low cost flip chip (LCFC): An innovative approach for breakthrough reduction in flip chip package cost