Instruct: Given the title of a paper, retrieve paper titles that are cited by the given paper.
Query: Exploring Phase Change Memory and 3D Die-Stacking for Power/Thermal Friendly, Fast and Durable Memory Architectures
Architecting phase change memory as a scalable dram alternative
A larger stacked layer number scalable TSV-based 3D-SRAM for high-performance universal-memory-capacity 3D-IC platforms
Phase-change random access memory: A scalable technology
Phase-change Memory
CACTI-3DD: Architecture-level modeling for 3D die-stacked DRAM main memory
Reliability Characterization ofPhase Change Memory
Phase-Change Memory—Towards a Storage-Class Memory
Data reorganization in memory using 3D-stacked DRAM
An optimized 3D-stacked memory architecture by exploiting excessive, high-density TSV bandwidth
Heterogeneous memory architectures: A HW/SW approach for mixing die-stacked and off-package memories
A novel architecture of the 3D stacked MRAM L2 cache for CMPs
A high-speed, low-power 3D-SRAM architecture
Coding-based energy minimization for phase change memory
3D-Stacked Memory Architectures for Multi-core Processors
A Novel 3D Cell Array Architecture for Terra-Bit NAND Flash Memory
Architecting 3D vertical resistive memory for next-generation storage systems
Vertical-channel stacked array (VCSTAR) for 3D NAND flash memory
Multiphysics Modeling and Impact of Thermal Boundary Resistance in Phase Change Memory Devices
Electronic switching in phase-change memories
Ultra-Thin Phase-Change Bridge Memory Device Using GeSb
Deep reinforcement learning of dialogue policies with less weight updates
Phase-change random access memory: A scalable technology
Objects and attention: the state of the art
Normalization as a canonical neural computation
Communication-Efficient Distributed Deep Metric Learning with Hybrid Synchronization