Instruct: Given the title of a scientific paper, retrieve paper titles that are cited by the given paper.
Query: Cu/Adhesive Hybrid Bonding at 180 °C in H-Containing HCOOH Vapor Ambient for 2.5D/3D Integration
Hybrid bonding technology with Cu-Cu/adhesives for high density 2.5D/3D integration
High Accuracy Thermal Compression Bonding Technology for Large-Sized Substrate
Modeling, design and demonstration of low-temperature, low-pressure and high-throughput thermocompression bonding of copper interconnections without solders
Low temperature Cu-Cu direct bonding for 3D-IC by using fine crystal layer
Cu/BCB hybrid bonding with TSV for 3D integration by using fly cutting technology
Properties Investigation on Chip-on-Film (COF) Thermosonic Bonding Using Anisotropic Conductive Films (ACFs)
High productivity thermal compression bonding for 3D-IC
Hybrid bonding of Cu/Sn microbump and adhesive with silica filler for 3D interconnection of single micron pitch
Resin Bond to Indirect Composite and New Ceramic/Polymer Materials: A Review of the Literature
Thermo-Compression Bonding for fine-pitch copper-pillar flip-chip interconnect - tool features as enablers of unique technology
Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding
6um Pitch High Density Cu-Cu Bonding for 3D IC Stacking
Ultra-fine pitch Cu-Cu bonding of 6μm bump pitch for 2.5D application
The Effect of Bending Compliance on Adhesion Pressure of Hybrid Electrostatic/Gecko-Like Adhesives
Comparison of resin bonding improvements to zirconia between one-bottle universal adhesives and tribochemical silica coating, which is better?
Influence of different etching modes on bond strength and fatigue strength to dentin using universal adhesive systems
Optimization of Bonding Force, Sinking Value, and Potting Gap Size in COF Inner Lead Bonding Process
Reliability of copper wire bonding in humidity environment
Wafer-level bonding/stacking technology for 3D integration
Bonding between oxide ceramics and adhesive cement systems: A systematic review
Activation of eosinophils by rice-husk dust exposure: a possible mechanism for the aggravation of asthma during rice harvest.
Solid waste management in Kolkata, India: practices and challenges.
Wafer-level hybrid bonding technology with copper/polymer co-planarization
Hydraulic failure and repair are not routine in trees
Searching for exoplanets in the Kepler public data