Instruct: Given a paper title, retrieve paper titles that are cited by the given paper.
Query: A Fully Integrated 16-Element Phased-Array Transmitter in SiGe BiCMOS for 60-GHz Communications
A Millimeter-Wave (40–45 GHz) 16-Element Phased-Array Transmitter in 0.18-$\mu$ m SiGe BiCMOS Technology
An X- and Ku-Band 8-Element Phased-Array Receiver in 0.18-$\mu{\hbox{m}}$ SiGe BiCMOS Technology
A 60-GHz SiGe BiCMOS Monostatic Transceiver for FMCW Radar Applications
Single-element and phased-array transceiver chipsets for 60-ghz Gb/s communications
Monolithic LTCC SiP transmitter for 60GHz wireless communication terminals
A 30/35 GHz Dual-Band Transmitter for Phased Arrays in Communication/Radar Applications
A 60 GHz Phase Shifter Integrated With LNA and PA in 65 nm CMOS for Phased Array Systems
A compact antenna-in-package 60-GHz SiGe BiCMOS radio
A 16-element W-band phased array transceiver chipset with flip-chip PCB integrated antennas for multi-gigabit data links
A bidirectional TX/RX four element phased-array at 60GHz with RF-IF conversion block in 90nm CMOS process
A 24-GHz SiGe phased-array receiver-LO phase-shifting approach
A quad-core 28–32 GHz transmit/receive 5G phased-array IC with flip-chip packaging in SiGe BiCMOS
A 28 GHz transceiver chip for 5G beamforming data links in SiGe BiCMOS
A 60 GHz, 802.11ad/WiGig-Compliant Transceiver for Infrastructure and Mobile Applications in 130 nm SiGe BiCMOS
A Low-Cost Scalable 32-Element 28-GHz Phased Array Transceiver for 5G Communication Links Based on a $2\times 2$ Beamformer Flip-Chip Unit Cell
A 15.5-dBm 160-GHz High-Gain Power Amplifier in SiGe BiCMOS Technology
Low-profile fully integrated 60 GHz 18 element phased array on multilayer liquid crystal polymer flip chip package
A Scalable 64-Element 280Hz Phased-Array Transceiver with 50 dBm EIRP and 8–12 Gbps 5G Link at 300 Meters without any Calibration
A 60 GHz single-chip 256-element wafer-scale phased array with EIRP of 45 dBm using sub-reticle stitching
A High-Linearity 76–85-GHz 16-Element 8-Transmit/8-Receive Phased-Array Chip With High Isolation and Flip-Chip Packaging
Caffeine consumption.
5G new radio and ultra low latency applications: A PHY implementation perspective
A chip-scale packaging technology for 60-GHz wireless chipsets
Design and Control of a Variable Stiffness Actuator Based on Adjustable Moment Arm
Adenosine-sensitive ventricular tachycardia. Clinical characteristics and response to catheter ablation