Instruct: Given the title of a paper, retrieve paper titles that are cited by the given paper
Query: Investigation of palladium coverage on bonded balls of palladium-coated copper wires
Wire bonding optimization with fine copper wire for volume production
Impact of aluminum wire and ribbon bonding technologies on D2PAK package reliability during thermal cycling applications
Development and electrical investigation of novel fine-pitch Cu/Sn pad bumping using ultra- thin buffer layer technique in 3D integration
Nanoparticle assembly and sintering towards all-copper flip chip interconnects
Current distribution in copper coils with parallel windings
Formation of highly reliable Cu/low-k interconnects by using CVD Co barrier in dual damascene structures
Radial growth of plasmon coupled gold nanowires on colloidal templates.
Effects of Bonding Parameters on the Reliability of Fine-Pitch Cu/Ni/SnAg Micro-Bump Chip-to-Chip Interconnection for Three-Dimensional Chip Stacking
Tungsten plug corrosion on B2H6-based nucleation layer induced by WCMP process
Roughening and Long-Range Nanopatterning of Au(111) through Potential Cycling in Aqueous Acidic Media
Material characterization of a novel lead-free solder material — SACQ
Optimization of Bonding Force, Sinking Value, and Potting Gap Size in COF Inner Lead Bonding Process
Accelerated SLID bonding using thin multi-layer copper-solder stack for fine-pitch interconnections
Intercell Busbar Design for Copper Electrowinning
Reliability study of Au-In transient liquid phase bonding for SiC power semiconductor packaging
Cu/Sn SLID wafer-level bonding optimization
Cutting Edge Titanium-based CVD Hard Coatings
Barrier/liner stacks for scaling the Cu interconnect metallization
Electronic and optical properties of Cu, CuO and Cu2O studied by electron spectroscopy
Cu-Cu hybrid bonding as option for 3D IC stacking
A Linear Algebraic Approach to Datalog Evaluation
HOW TO GAMIFY INFORMATION SYSTEMS - ADAPTING GAMIFICATION TO INDIVIDUAL PREFERENCES
A cell culture model for T lymphocyte clonal anergy.
Mechanism of Paroxetine (Paxil) Inhibition of the Serotonin Transporter
Behaviors of palladium in palladium coated copper wire bonding process