Instruct: Given the title of a scientific paper, retrieve paper titles that are cited by the given paper.
Query: A new approach to wafer sawing: stealth laser dicing technology
Advanced dicing technology for semiconductor wafer -Stealth Dicing
Review of wafer dicing techniques for via-middle process 3DI/TSV ultrathin silicon device wafers
Multi-photon absorption enhancement by dual-wavelength double-pulse laser irradiation for efficient dicing of sapphire wafers
Unusual defects, generated by wafer sawing: An update, including pick&place processing
Evaluation for UV laser dicing process and its reliability for various designs of stack chip scale package
Investigation of Advanced Dicing Technologies for Ultra Low-k and 3D Integration
Development of stealth dicing tape for TSV process
2-Step algorithm for automatic alignment in wafer dicing process
Thin Silicon Wafer Device Concept with Advanced Laser Annealing and Sintering Process
Single & multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer
Assessment of dicing induced damage and residual stress on the mechanical and electrical behavior of chips
Ultrathin glass wafer lamination and laser debonding to enable glass interposer fabrication
Ultra-fast fibre laser systems based on SESAM technology: new horizons and applications
Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing
Laser-Cutting Pneumatics
Fiber Lasers of Prof. Okhotnikov: Review of the Main Achievements and Breakthrough Technologies
Characterization of dicing tape adhesion for ultra-thin die pick-up process
CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration
Lasers, Lights and Other Technologies
An Integrated Hybrid Silicon Multiwavelength AWG Laser
Improving quality of training data for learning to rank using click-through data
PointSeg: Real-Time Semantic Segmentation Based on 3D LiDAR Point Cloud
Precise ellipse estimation without contour point extraction
The structure of the information visualization design space
Novel wafer dicing and chip thinning technologies realizing high chip strength