Instruct: Given a scientific paper title, retrieve paper titles that are cited by the given paper
Query: High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications
A broadband 3D vertical Microstrip to Stripline transition in LTCC using a quasi-coaxial structure for millimetre-wave SOP applications
Monolithic LTCC SiP transmitter for 60GHz wireless communication terminals
An innovative embedded interposer carrier for high density interconnection
A 32-Gb/s backplane transceiver with on-chip AC-coupling and low latency CDR in 32-nm SOI CMOS technology
Terabit/s-class 24-channel bidirectional optical transceiver module based on TSV Si carrier for board-level interconnects
Compact LTCC Rat-Race Couplers Using Multilayered Phase-Delay and Phase-Advance T-Equivalent Sections
Reliability of dual-damascene local interconnects featuring cobalt on 10 nm logic technology
>1.3-Tb/s VCSEL-Based On-Board Parallel-Optical Transceiver Module for High-Density Optical Interconnects
Design Methodology for Thin-Film Transistor Based Pseudo-CMOS Logic Array with Multi-Layer Interconnect Architecture
Current-Mode Transceiver for Silicon Interposer Channel
A 90nm CMOS 16Gb/s Transceiver for Optical Interconnects
Low Loss Compact Meander Stripline Delay Lines Using LTCC
Low-k interconnect stack with metal-insulator-metal capacitors for 22nm high volume manufacturing
Thermal and Electrical Performance of Direct Bond Interconnect Technology for 2.5D and 3D Integrated Circuits
Design of the ultrafast LVDS I/O interface in 40 nm CMOS process
Interconnect characteristics of 2.5-D system integration scheme
Low-Loss Patterned Ground Shield Interconnect Transmission Lines in Advanced IC Processes
Design of high-speed wireline transceivers for backplane communications in 28nm CMOS
Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package
Development of next-generation system-on-package ( SOP ) technology based on silicon carriers with fine-pitch chip interconnection
Genomic Medicine: New Frontiers and New Challenges
Mersenne twister-based RFID authentication protocol
A broadband transition between microstrip and coplanar stripline
FAIoT: Towards Building a Forensics Aware Eco System for the Internet of Things
The evolution of general intelligence