Instruct: Given the title of a paper, retrieve paper titles that are cited by the given paper.
Query: Chip/package interactions on advanced flip-chip packages: Mechanical investigations on copper pillar bumping
Reliability Study on Copper Pillar Bumping with Lead Free Solder
Development of fluxless chip-on-wafer bonding process for 3DIC chip stacking with 30μm pitch lead-free solder micro bumps and reliability characterization
Nanoparticle assembly and sintering towards all-copper flip chip interconnects
Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering
Low cost flip chip (LCFC): An innovative approach for breakthrough reduction in flip chip package cost
RF Characterization and Modeling of 10 µm Fine-Pitch Cu-Pillar on a High Density Silicon Interposer
Plasma reflow bumping of Sn-3.5 Ag solder for flux-free flip chip package application
Design, Fabrication, and Characterization of Novel Vertical Coaxial Transitions for Flip-Chip Interconnects
Advanced flip chip package on package technology for mobile applications
Development of Next Generation Flip Chip Interconnection Technology Using Homogenized Laser-Assisted Bonding
Ultra Fine Pitch / Low Cost FCCSP Package and Chip Package Interaction (CPI) for Advanced CMOS Nodes
Cu pillar bump-on-trace (BoT) design for ultra low-k packaging
A unique failure mechanism induced by chip to board interaction on fan-out wafer level package
Hybrid bonding of Cu/Sn microbump and adhesive with silica filler for 3D interconnection of single micron pitch
Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)
Development of large die fine pitch flip chip BGA using TCNCP technology
6um Pitch High Density Cu-Cu Bonding for 3D IC Stacking
Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds
Chip-to-Wafer (C2W) flip chip bonding for 2.5D high density interconnection on TSV free interposer
Issues in fatigue life prediction model for underfilled flip chip bump
Cu pillar bumps as a lead-free drop-in replacement for solder-bumped, flip-chip interconnects
Models of L-Band Radar Backscattering Coefficients Over Global Terrain for Soil Moisture Retrieval
Dynamic Channel Assignment for Wireless Sensor Networks: A Regret Matching Based Approach
Network Forensics Models for Converged Architectures
Low-Power CMOS Equalizer Design for 20-Gb/s Systems