Instruct: Given a scientific paper title, retrieve paper titles that are cited by the given paper.
Query: 28nm CPI (Chip/Package Interactions) in Large Size eWLB (Embedded Wafer Level BGA) Fan-Out Wafer Level Packages
Array antenna integrated fan-out wafer level packaging (InFO-WLP) for millimeter wave system applications
Fan-Out Chip on Substrate Device Interconnection Reliability Analysis
Chip-packaging interaction: a critical concern for Cu/low k packaging
Warpage simulation and experiment for panel level fan-out package
Warpage Study of Large 2.5D IC Chip Module
A Comprehensive Study on Stress and Warpage by Design, Simulation and Fabrication of RDL-First Panel Level Fan-Out Technology for Advanced Package
Effects of Bonding Parameters on the Reliability of Fine-Pitch Cu/Ni/SnAg Micro-Bump Chip-to-Chip Interconnection for Three-Dimensional Chip Stacking
Chip-to-Wafer (C2W) flip chip bonding for 2.5D high density interconnection on TSV free interposer
Wafer Level Multi-chip Gang Bonding Using TCNCF
Double side redistribution layer process on embedded wafer level package for package on package (PoP) applications
Thermo-Compression Bonding for fine-pitch copper-pillar flip-chip interconnect - tool features as enablers of unique technology
Development of next-generation system-on-package ( SOP ) technology based on silicon carriers with fine-pitch chip interconnection
Chip scale package with low cost substrate evaluation and characterization
Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds
Development of Next Generation Flip Chip Interconnection Technology Using Homogenized Laser-Assisted Bonding
Novel wafer dicing and chip thinning technologies realizing high chip strength
Electrical and optical on-chip interconnects in scaled microprocessors
Millimeter-Wave Antenna in Fan-Out Wafer Level Packaging for 60 GHz WLAN Application
Through silicon via technology — processes and reliability for wafer-level 3D system integration
Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration
Into the Colorful World of Webtoons: Through the Lens of Neural Networks
Packages With Integrated 60-GHz Aperture-Coupled Patch Antennas
Towards Unified Object Detection and Semantic Segmentation
Plasticity of the visual system after early brain damage
Fairness, Feelings, and Ethical Decision- Making: Consequences of Violating Community Standards of Fairness