Instruct: Given a scientific paper title, retrieve paper titles that are cited by the given paper
Query: Redistribution-Layers (RDLS) for Fan-Out Panel-Level Packaging
Fan-out wafer-level packaging for 3D IC heterogeneous integration
The Reliability Challenges of Qfn Packaging
Structurally optimized sandwich panels with prismatic cores
Power saving and noise reduction of 28nm CMOS RF system integration using integrated fan-out wafer level packaging (InFO-WLP) technology
RDL layout pattern reliability analysis and optimization with TCAD stress modeling
The importance of packaging attributes: a conjoint analysis approach
A Survey of Automated Layout Techniques for Information Presentations
Chip Level Techniques for EMI Reduction in LCD Panels
Thin glass based packaging technologies for optoelectronic modules
Cutting and Packing
Design and Reliability in Wafer Level Packaging
InFO (Wafer Level Integrated Fan-Out) Technology
Packaging: past, present and future
Planar fiber packaging method for silicon photonic integrated circuits
Transient liquid phase (TLP) bonding for microsystem packaging applications
Optimal Rectangle Packing: An Absolute Placement Approach
Recent advances in modeling the underfill process in flip-chip packaging
Layout Decomposition Approaches for Double Patterning Lithography
Demonstration of 2µm RDL wiring using dry film photoresists and 5µm RDL via by projection lithography for low-cost 2.5D panel-based glass and organic interposers
Productivity improvement of a manufacturing facility using systematic layout planning
System in wafer-level package technology with RDL-first process
treatment of chronic prostatitis / chronic pelvic pain syndrome category iiia with serenoa repens plus selenium and lycopene ( profluss ) versus s . repens alone : an italian randomized multicenter - controlled study .
Diabetic retinopathy classification using deeply supervised ResNet
Model of a Heat Recovery Steam Generator ( HRSG ) Process and Simulation in Steady State and Transient Operation
Defining Open Source Software Project Success