Instruct: Given a scientific paper title, retrieve paper titles that are cited by the given paper
Query: Wafer Level Multi-chip Gang Bonding Using TCNCF
High throughput thermal compression NCF bonding
All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering
High Density Through Wafer Via Technology
Reverse wire bonding and phosphor printing for LED wafer level packaging
Transient liquid phase (TLP) bonding for microsystem packaging applications
Hybrid bonding of Cu/Sn microbump and adhesive with silica filler for 3D interconnection of single micron pitch
From wafer level to panel level mold embedding
Direct Bond Interconnect (DBI®) for fine-pitch bonding in 3D and 2.5D integrated circuits
High Density TSV-Free Interposer (TFI) Packaging with Submicron Cu Damascene RDLs for Integration of CPU/GPU and HBM
From fan-out wafer to fan-out panel level packaging
Ultra-fine pitch Cu-Cu bonding of 6μm bump pitch for 2.5D application
Fabrication of GaInP/GaAs//Si Solar Cells by Surface Activated Direct Wafer Bonding
Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration
Ultrathin glass wafer lamination and laser debonding to enable glass interposer fabrication
Thin Silicon Wafer Device Concept with Advanced Laser Annealing and Sintering Process
Next Generation Nickel-Based Bond Pads Enable Copper Wire Bonding
FoToNoC: A Folded Torus-Like Network-on-Chip Based Many-Core Systems-on-Chip in the Dark Silicon Era
Band-to-Band Tunneling in Carbon Nanotube Field-Effect Transistors
New Ultra Thin Chip Scale Package (CSP) based on Thermo-Sonic Flip-Chip Interconnection
NCFET: Opportunities & challenges for advanced technology nodes
Gastric rupture with necrosis following acute gastric dilatation: report of a case
Development of large die fine pitch flip chip BGA using TCNCP technology
social network games : players ’ perspectives .
DeepKey: An EEG and Gait Based Dual-Authentication System
A quantitative analysis on microarchitectures of modern CPU-FPGA platforms