Instruct: Given the title of a paper, retrieve paper titles that are cited by the given paper
Query: 2.5D IC Micro-Bump Materials Characterization and IMCs Evolution Under Reliability Stress Conditions
A novel double layer NCF for highly reliable micro-bump interconnection
A Glass-in-Silicon Reflow Process for Three-Dimensional Microsystems
All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering
3-D ICs: A Novel Chip Design for Improving Deep-Submicrometer Interconnect Performance and Systems-on-Chip Integration
Die Attach Material for Power Semiconductor Having Nano-Level Sn-Cu Diffusion Control
Material characterization of a novel lead-free solder material — SACQ
Determination of the Interfacial Fracture Toughness of Laminated Silicon Die on Adhesive Dicing Tape from Stud Pull Measurement
Thermal analysis of a 3D die-stacked high-performance microprocessor
Reliability Comparison of ZrO2-Based DRAM High-k Dielectrics Under DC and AC Stress
Thermal Feasibility of Die-Stacked Processing in Memory
Corrosion Study and Intermetallics Formation in Gold and Copper Wire Bonding in Microelectronics Packaging
Direct Bond Interconnect (DBI®) for fine-pitch bonding in 3D and 2.5D integrated circuits
Multiphysics Modeling and Impact of Thermal Boundary Resistance in Phase Change Memory Devices
Development and electrical investigation of novel fine-pitch Cu/Sn pad bumping using ultra- thin buffer layer technique in 3D integration
Aging mechanisms of X2 metallized film capacitors in a high temperature and humidity environment
copper pillar shape and related stress simulation studies in flip chip packages .
Effects of length scaling on electromigration in dual-damascene copper interconnects
Investigation of Cu/low-k film delamination in flip chip packages
Characterization studies of fluorine-induced corrosion crystal defects on microchip Al bondpads using X-ray photoelectron spectroscopy
Avoiding flex cracks in ceramic capacitors: Analytical tool for a reliable failure analysis and guideline for positioning cercaps on PCBs
Music-syntactic processing and auditory memory: Similarities and differences between ERAN and MMN
Cu pillar bumps as a lead-free drop-in replacement for solder-bumped, flip-chip interconnects
CBR Based Workflow Composition Assistant
Similarity Measure Selection for Clustering Time Series Databases
Cholera Toxin: An Intracellular Journey into the Cytosol by Way of the Endoplasmic Reticulum