Instruct: Given a paper title, retrieve paper titles that are cited by the given paper
Query: 3D-IC thermo-compression collective bonding process using high temperature stage
Heat transfer analysis in the thermal compression bonding for CoW process
Thermoelectric Cooling-Aided Bead Geometry Regulation in Wire and Arc-Based Additive Manufacturing of Thin-Walled Structures
Thermal and Electrical Performance of Direct Bond Interconnect Technology for 2.5D and 3D Integrated Circuits
Quality and reliability investigation of Ni/Sn transient liquid phase bonding technology
Mean-field homogenization of multi-phase thermo-elastic composites: a general framework and its validation
An end-to-end approach to making self-folded 3D surface shapes by uniform heating
A review of the experimental techniques for the measurement of heat and temperatures generated in some manufacturing processes and tribology
Cu-Cu hybrid bonding as option for 3D IC stacking
Cu@Sn Core–Shell Structure Powder Preform for High-Temperature Applications Based on Transient Liquid Phase Bonding
Thermo-Mechanical Simulation of Wire Bonding Joints in Power Modules
Simplification of the Nanosilver Sintering Process for Large-Area Semiconductor Chip Bonding: Reduction of Hot-Pressing Temperature Below 200/spl deg/C
Bioinspired Engineering of Thermal Materials
Thermal analysis of a 3D die-stacked high-performance microprocessor
A Glass-in-Silicon Reflow Process for Three-Dimensional Microsystems
Resin Bond to Indirect Composite and New Ceramic/Polymer Materials: A Review of the Literature
Reliability study of Au-In transient liquid phase bonding for SiC power semiconductor packaging
Thermo-mechanical model with adaptive boundary conditions for friction stir welding of Al 6061
Generating High Fidelity 3-D Thermograms With a Handheld Real-Time Thermal Imaging System
Friction stir welding and processing
Localized induction heating solder bonding for wafer level MEMS packaging
Internet of Things: Ubiquitous Home Control and Monitoring System using Android based Smart Phone
What is the most important component of blood pressure: systolic, diastolic or pulse pressure?
High throughput thermal compression NCF bonding
The relationship between nomophobia and the distraction associated with smartphone use among nursing students in their clinical practicum
Europa Clipper mission: the habitability of an icy moon