Instruct: Given a paper title, retrieve paper titles that are cited by the given paper.
Query: Warpage Simulation and Optimization of Fan-Out Wafer level Package(FO-WLP) with TMV under Different Processes
System in wafer-level package technology with RDL-first process
Universal Compact Model for Thin-Film Transistors and Circuit Simulation for Low-Cost Flexible Large Area Electronics
Effect of UBM and BCB layers on the thermo-mechanical reliability of wafer level chip scale package (WLCSP)
A Characterized Redistribution Layer Architecture for Advanced Packaging Technologies
Balanced embedded trace substrate design for warpage control
Chip-packaging interaction: a critical concern for Cu/low k packaging
Ultra-Low Temperature FOWLP Process for the Embedding of Low Thermal Budget Sensors and Components Using SU-8 as Dielectric
Advanced QFN packaging for low cost and solution
Simulation Study of a New Body-Tied FinFETs (Omega MOSFETs) Using Bulk Si Wafers
Wafer-Scale Millimeter-Wave Phased-Array RFICs
Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package
Advanced flip chip package on package technology for mobile applications
On the wafer/pad friction of linear chemical-mechanical planarization (CMP): modeling, analysis and experiments
CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration
Novel RDL Design of Wafer-Level Packaging for Signal/Power Integrity in LPDDR4 Application
Embedded wafer level ball grid array (eWLB) technology for system integration
Through silicon via technology — processes and reliability for wafer-level 3D system integration
Design Methodology for Thin-Film Transistor Based Pseudo-CMOS Logic Array with Multi-Layer Interconnect Architecture
0.35mm pitch wafer level package board level reliability: Studying effect of ball de-population with varying ball size
Warpage Study of Large 2.5D IC Chip Module
Flattening curved documents in images
Production, Manufacturing and Logistics Dynamic pricing with real-time demand learning
Embedded wafer level ball grid array (eWLB)
Animating human dressing
Design and development of 6-DOF robotic arm controlled by Man Machine Interface