Instruct: Given a paper title, retrieve paper titles that are cited by the given paper.
Query: Thermal characterisation of a copper-clip-bonded IGBT module with double-sided cooling
Integrated double sided cooling packaging of planar SiC power modules
An improved analytical IGBT model for loss calculation including junction temperature and stray inductance
Dbc (direct bond copper) substrate with integrated flat heat pipe
Superjunction IGBT vs. FS IGBT for 200°C operation
Investigation on Current Crowding Effect in IGBTs
Turn-on loss vs. free-wheel diode recovery dv/dt in IGBT modules
Advanced Thermal Management Solutions on PCBs for High Power Applications
Improved SPICE modeling and analysis of a thermoelectric module
A Snapback Suppressed Reverse-Conducting IGBT With a Floating p-Region in Trench Collector
Direct substrate cooling of power electronics
Short circuit III in high power IGBTs
Reliability assessment of SiC power module stack based on thermo-structural analysis
Integrated dc-dc based-GaN converter with screen printed capacitors allowing double side cooling
Impacts of cooling technology on solder fatigue for power modules in electric traction drive vehicles
Direct liquid cooling module with high reliability solder joining technology for automotive applications
Accurate Modeling of Thermal Resistance for On-Wafer SiGe HBTs Using Average Thermal Conductivity
Short-circuit ruggedness of high-voltage IGBTs
Thermoelectric Cooling-Aided Bead Geometry Regulation in Wire and Arc-Based Additive Manufacturing of Thin-Walled Structures
Thermal via placement for high-power applications
A New Output Current Measurement Method With Tiny PCB Sensors Capable of Being Embedded in an IGBT Module
Wnt signaling: a win for bone.
A review of WBG power semiconductor devices
Anytime Point-Based Approximations for Large POMDPs
Face recognition using Histograms of Oriented Gradients
Antibacterial activities of flavonoids: structure-activity relationship and mechanism.