Instruct: Given a scientific paper title, retrieve paper titles that are cited by the given paper
Query: Investigation of Advanced Dicing Technologies for Ultra Low-k and 3D Integration
Advanced dicing technology for semiconductor wafer -Stealth Dicing
High Density Through Wafer Via Technology
Reliability of Cu pillar bumps for flip-chip packages with ultra low-k dielectrics
Single & multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer
Key Properties for Successful Ultra Thin Die Pickup
Three-Dimensional Integrated Circuits
Fan-out wafer-level packaging for 3D IC heterogeneous integration
Cu pillar bump-on-trace (BoT) design for ultra low-k packaging
processor design in 3d die - stacking technologies .
Chip-packaging interaction: a critical concern for Cu/low k packaging
Investigation of Cu/low-k film delamination in flip chip packages
6um Pitch High Density Cu-Cu Bonding for 3D IC Stacking
Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon
Novel flowable CVD process technology for sub-20nm interlayer dielectrics
Wafer level packaging (WLP): Fan-in, fan-out and three-dimensional integration
Low-k interconnect stack with metal-insulator-metal capacitors for 22nm high volume manufacturing
A novel integrated dielectric-and-conductive ink 3D printing technique for fabrication of microwave devices
Formation of highly reliable Cu/low-k interconnects by using CVD Co barrier in dual damascene structures
Cu/BCB hybrid bonding with TSV for 3D integration by using fly cutting technology
A Novel Photosensitive Dry-Film Dielectric Material for High Density Package Substrate, Interposer and Wafer Level Package
Automated Metareviewing: A Classifier Approach to Assess the Quality of Reviews
Deep Learning-Based Document Modeling for Personality Detection from Text
Whole-genome sequencing and comprehensive molecular profiling identify new driver mutations in gastric cancer
Equality proofs and deferred type errors: a compiler pearl
Laser grooving characterization for dicing defects reduction and its challenges