Instruct: Given a paper title, retrieve paper titles that are cited by the given paper.
Query: Cu Pillar and μ-bump electromigration reliability and comparison with high pb, SnPb, and SnAg bumps
Analysis of electromigration for Cu pillar bump in flip chip package
Intrinsic study of current crowding and current density gradient effects on electromigration in BEOL copper interconnects
Cu pillar bumps as a lead-free drop-in replacement for solder-bumped, flip-chip interconnects
Recent advances on electromigration in very-large-scale-integration of interconnects
Electromigration and its impact on physical design in future technologies
Effects of length scaling on electromigration in dual-damascene copper interconnects
Development and electrical investigation of novel fine-pitch Cu/Sn pad bumping using ultra- thin buffer layer technique in 3D integration
Effects of Bonding Parameters on the Reliability of Fine-Pitch Cu/Ni/SnAg Micro-Bump Chip-to-Chip Interconnection for Three-Dimensional Chip Stacking
A Study on the Double Layer Non Conductive Films (NCFs) for Fine-Pitch Cu-Pillar/Sn-Ag Micro-Bump Interconnection
Plasma reflow bumping of Sn-3.5 Ag solder for flux-free flip chip package application
Effect of passivation annealing on the electromigration properties of hybrid bonding stack
Reliability evaluation of copper (Cu) through-silicon via (TSV) barrier and dielectric liner by electrical characterization
Contact resistance of solder bump with low cost photosensitive polyimide for high performance SoC
RF Characterization and Modeling of 10 µm Fine-Pitch Cu-Pillar on a High Density Silicon Interposer
Analysis of critical-length data from Electromigration failure studies
copper pillar shape and related stress simulation studies in flip chip packages .
Hybrid bonding of Cu/Sn microbump and adhesive with silica filler for 3D interconnection of single micron pitch
Ultra-fine pitch Cu-Cu bonding of 6μm bump pitch for 2.5D application
Characterization of Au-Sn eutectic die attach process for optoelectronics device
Electromigration reliability of open TSV structures
The necessary and sufficient conditions of therapeutic personality change.
Reliability Study on Copper Pillar Bumping with Lead Free Solder
FUZZY ARTMAP CLASSIFICATION FOR MOTOR IMAGINARY BASED BRAIN COMPUTER INTERFACE
Gate-first high-k/metal gate DRAM technology for low power and high performance products
News via Voldemort: Parody accounts in topical discussions on Twitter