Instruct: Given a paper title, retrieve paper titles that are cited by the given paper.
Query: On the wafer/pad friction of chemical-mechanical planarization (CMP) processes- Part II: experiments and applications
On the wafer/pad friction of chemical-mechanical planarization (CMP) processes - Part I: modeling and analysis
Novel wafer dicing and chip thinning technologies realizing high chip strength
Stiction in surface micromachining
Investigation on wafer warpage evolution and wafer asymmetric deformation in fan-out wafer level packaging processes
CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration
Solutions Strategies for Die Shift Problem in Wafer Level Compression Molding
Characterization of dicing tape adhesion for ultra-thin die pick-up process
Investigation and Failure Analysis of "Flower-like" Defects on Microchip Aluminum Bondpads in Wafer Fabrication
Investigation of single cut process in mechanical dicing for thick metal wafer
Unusual defects, generated by wafer sawing: An update, including pick&place processing
The Mechanics of Machining at the Microscale : Assessment of the Current State of the Science
Wafer Dicing Using Dry Etching on Standard Tapes and Frames
Fundamental characteristics of electrostatic wafer chuck with insulating sealant
Warpage Simulation and Optimization of Fan-Out Wafer level Package(FO-WLP) with TMV under Different Processes
Cu/Sn SLID wafer-level bonding optimization
Research of Fan-Out Panel Level Package (FOPLP) manufacturing process using single-sided adhesive tape
Comprehensive Investigation of Die Shift in Compression Molding Process for 12 Inch Fan-Out Wafer Level Packaging
Reduction of wafer arcing during high aspect ratio etching
Warpage Prediction and Experiments of Fan-Out Waferlevel Package During Encapsulation Process
Thermo-Compression Bonding for fine-pitch copper-pillar flip-chip interconnect - tool features as enablers of unique technology
Evaluation of neck masses in adults.
Skeletal muscle mechanics, energetics and plasticity
Improving Protein Gamma-Turn Prediction Using Inception Capsule Networks
Do motivations for using Facebook moderate the association between Facebook use and psychological well-being?
Pad porosity, compressibility and slurry delivery effects in chemical- mechanical planarization: modeling and experiments