Instruct: Given a paper title, retrieve paper titles that are cited by the given paper
Query: Cu-Sn based joint material having IMC forming control capabilities
Die Attach Material for Power Semiconductor Having Nano-Level Sn-Cu Diffusion Control
Nanoparticle assembly and sintering towards all-copper flip chip interconnects
Microstructure of selective laser melted CM247LC nickel-based superalloy and its evolution through heat treatment
Fabrication and characterization of gold-tin eutectic bonding for hermetic packaging of MEMS devices
A Study on the Double Layer Non Conductive Films (NCFs) for Fine-Pitch Cu-Pillar/Sn-Ag Micro-Bump Interconnection
Tungsten and cobalt metallization: A material study for MOL local interconnects
Wafer-level Cu-Cu bonding technology
All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering
Use of Non-conductive Film (NCF) with Nano-Sized Filler Particles for Solder Interconnect: Research and Development on NCF Material and Process Characterization
Modeling, design and demonstration of low-temperature, low-pressure and high-throughput thermocompression bonding of copper interconnections without solders
Effects of Bonding Parameters on the Reliability of Fine-Pitch Cu/Ni/SnAg Micro-Bump Chip-to-Chip Interconnection for Three-Dimensional Chip Stacking
Cu Pillar and μ-bump electromigration reliability and comparison with high pb, SnPb, and SnAg bumps
Corrosion Study and Intermetallics Formation in Gold and Copper Wire Bonding in Microelectronics Packaging
review of incremental forming of sheet metal components .
Thermal Cycling Reliability of Lead-Free Solders (SAC305 and Sn3.5Ag) for High-Temperature Applications
Synthesis , Characterization , and Electronic Structure of Single-Crystal SnS , Sn 2 S 3 , and SnS 2
Barrier/liner stacks for scaling the Cu interconnect metallization
Thermoplastic Forming of Bulk Metallic Glass— A Technology for MEMS and Microstructure Fabrication
Reduction of Voids in Solder Joints an Alternative to Vacuum Soldering
Metallurgical Characterization of Controlled Memory Wire Nickel-Titanium Rotary Instruments
The Effect of Celebrity Endorsement on Creating Brand Loyalty : An Application on the Lebanese Cosmetic Sector ’ s Demand
QuaterNet: A Quaternion-based Recurrent Model for Human Motion
CT-index: Fingerprint-based graph indexing combining cycles and trees
Accelerated SLID bonding using thin multi-layer copper-solder stack for fine-pitch interconnections
LBNL-62937 Microgrids : An Overview of Ongoing Research , Development , and Demonstration Projects