Instruct: Given the title of a paper, retrieve paper titles that are cited by the given paper
Query: Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering
High quality & low thermal resistance eutectic flip chip LED bonding
Cu pillar bumps as a lead-free drop-in replacement for solder-bumped, flip-chip interconnects
COF ( Chip-On-Film ) Technology for LCD Driver ICs Using Reel-to-Reel System
A unique failure mechanism induced by chip to board interaction on fan-out wafer level package
Planar fiber packaging method for silicon photonic integrated circuits
Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs
Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package
Modeling, design, fabrication and characterization of first large 2.5D glass interposer as a superior alternative to silicon and organic interposers at 50 micron bump pitch
Effects of Bonding Parameters on the Reliability of Fine-Pitch Cu/Ni/SnAg Micro-Bump Chip-to-Chip Interconnection for Three-Dimensional Chip Stacking
Design, Fabrication, and Characterization of Ultrathin 3-D Glass Interposers With Through-Package-Vias at Same Pitch as TSVs in Silicon
Accelerated SLID bonding using thin multi-layer copper-solder stack for fine-pitch interconnections
Development and electrical investigation of novel fine-pitch Cu/Sn pad bumping using ultra- thin buffer layer technique in 3D integration
Hybrid bonding of Cu/Sn microbump and adhesive with silica filler for 3D interconnection of single micron pitch
Improved QFN Reliability by flank tin plating process after singulation
Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds
Development of Novel High Density System Integration Solutions in FOWLP-Complex and Thin Wafer-Level SiP and Wafer-Level 3D Packages
Nickel-Tin Transient Liquid Phase (TLP) Wafer Bonding for MEMS Vacuum Packaging
Opportunities of Fan-out Wafer Level Packaging (FOWLP) for RF applications
Thin glass based packaging technologies for optoelectronic modules
Novel RDL Design of Wafer-Level Packaging for Signal/Power Integrity in LPDDR4 Application
RefocusGAN: Scene Refocusing Using a Single Image
Using design thinking to improve psychological interventions: The case of the growth mindset during the transition to high school.
Thermal Transient Characteristics of Die Attachin High Power LED PKG
Detection of emotions during learning with AutoTutor
Evidence for topographic organization in the cerebellum of motor control versus cognitive and affective processing