Instruct: Given the title of a scientific paper, retrieve paper titles that are cited by the given paper
Query: High Accuracy Thermal Compression Bonding Technology for Large-Sized Substrate
Heat transfer analysis in the thermal compression bonding for CoW process
Impact of aluminum wire and ribbon bonding technologies on D2PAK package reliability during thermal cycling applications
Wafer-level hybrid bonding technology with copper/polymer co-planarization
Wafer-level bonding/stacking technology for 3D integration
Laser Assisted Bonding Technology Enabling Fine Bump Pitch in Flip Chip Package Assembly
Friction stir welding and processing
Next Generation Nickel-Based Bond Pads Enable Copper Wire Bonding
Dbc (direct bond copper) substrate with integrated flat heat pipe
Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors
direct silicon – silicon bonding by electromagnetic induction heating .
Reliability study of Au-In transient liquid phase bonding for SiC power semiconductor packaging
Optimization of Bonding Force, Sinking Value, and Potting Gap Size in COF Inner Lead Bonding Process
Study on bond pad damage issue in bare Cu wire bonding on SMOS8MV wafer technology
Nickel-Tin Transient Liquid Phase (TLP) Wafer Bonding for MEMS Vacuum Packaging
Development of Next Generation Flip Chip Interconnection Technology Using Homogenized Laser-Assisted Bonding
Low-Temperature, Strong SiO2-SiO2 Covalent Wafer Bonding for III–V Compound Semiconductors-to-Silicon Photonic Integrated Circuits
wafer direct bonding : from advanced substrate engineering to future applications in micro / nanoelectronics .
6um Pitch High Density Cu-Cu Bonding for 3D IC Stacking
Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds
Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips
Deep convolutional neural network and 3D deformable approach for tissue segmentation in musculoskeletal magnetic resonance imaging
Beyond the trustworthy tweet: A deeper understanding of microblogged data use by disaster response and humanitarian relief organizations
Use of Non-conductive Film (NCF) with Nano-Sized Filler Particles for Solder Interconnect: Research and Development on NCF Material and Process Characterization
Energy-based Generative Adversarial Network
On Exploiting Transient Social Contact Patterns for Data Forwarding in Delay-Tolerant Networks