Instruct: Given a scientific paper title, retrieve paper titles that are cited by the given paper
Query: Effects of Pd distribution at free air ball in Pd coated Cu wire
More uniform Pd distribution in free-air balls of Pd-coated Cu bonding wire using movable flame-off electrode
Pitfalls and solutions of replacing gold wire with palladium coated copper wire in IC wire bonding
Corrosion Study and Intermetallics Formation in Gold and Copper Wire Bonding in Microelectronics Packaging
Ultra-fine pitch Cu-Cu bonding of 6μm bump pitch for 2.5D application
Mechanistic Investigation and Prevention of Al Bond Pad Corrosion in Cu Wire-Bonded Device Assembly
Next Generation Nickel-Based Bond Pads Enable Copper Wire Bonding
Current distribution in copper coils with parallel windings
Shape-Controlled Synthesis of Pd Nanocrystals and Their Catalytic Applications
Wire bonding optimization with fine copper wire for volume production
Plasma cleaning on bond pad surfaces for gold wire bonding
Innovative needle winding method using curved wire guide in order to significantly increase the copper fill factor
Size Dependence of Doping by a Vacancy Formation Reaction in Copper Sulfide Nanocrystals.
Electronic and optical properties of Cu, CuO and Cu2O studied by electron spectroscopy
Scaling Cu Pillars to 20um Pitch and Below: Critical Role of Surface Finish and Barrier Layers
Tungsten and cobalt metallization: A material study for MOL local interconnects
Tungsten plug corrosion on B2H6-based nucleation layer induced by WCMP process
Intercell Busbar Design for Copper Electrowinning
Copper Nanoparticles for Printed Electronics: Routes Towards Achieving Oxidation Stability
Mathematical description of PCB-adapted litz wire geometry for automated layout generation of WPT coils
Barrier/liner stacks for scaling the Cu interconnect metallization
Designer babies: choosing our children's genes
A +70-dBm IIP3 Electrical-Balance Duplexer for Highly Integrated Tunable Front-Ends
Chapter 2 Jump-Diffusion Models for Asset Pricing in Financial Engineering
Automatic Detection and Classification of Glioma Tumors using Statistical Features
Characterization of palladium coated copper wire prior physical bonding assessment