Instruct: Given a paper title, retrieve paper titles that are cited by the given paper
Query: Chip-to-rectangular waveguide transition realized in embedded Wafer Level Ball Grid Array (eWLB) package
Embedded wafer level ball grid array (eWLB)
Ultra-Wideband CPW-to-Substrate Integrated Waveguide Transition Using an Elevated-CPW Section
A general EM-based design procedure for single-layer substrate integrated waveguide interconnects with microstrip transitions
Novel wide-band coplanar waveguide-to-rectangular waveguide transition
3D eWLB (embedded wafer level BGA) technology for 3D-packaging/3D-SiP (Systems-in-Package) applications
Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration
Broadband SIW-to-Waveguide Transition in Multilayer LCP Substrates at W-Band
Substrate Integrated Waveguide-to-Microstrip Transition in Multilayer Substrate
A PCB-Embedding Scheme for LCP Ribbon Waveguide at D-band
Broadband transition between substrate integrated waveguide and rectangular waveguide based on ridged steps
A chip-scale packaging technology for 60-GHz wireless chipsets
A W-Band Low-Loss and Wideband LTCC Transition From Waveguide to Microstrip
50–60 GHz waveguide to microstrip transition on LTCC for enabling integrated MMIC packaging
Ground coplanar waveguide to rectangular waveguide transition
Millimeter-wave wideband transition from CPW to substrate integrated waveguide on electrically thick high-permittivity substrates
Wafer level packaging (WLP): Fan-in, fan-out and three-dimensional integration
Development of a Broadband Coplanar Waveguide-to-Microstrip Transition With Vias
Design and Reliability in Wafer Level Packaging
Compact wideband single-ended and differential microstrip-to-waveguide transitions at W-band
Waveguide-to-Microstrip Antipodal Finline Transition at W Band
Embedded wafer level ball grid array (eWLB) technology for system integration
Neural Segmental Hypergraphs for Overlapping Mention Recognition
Mining Association Rules with Item Constraints
BEHAVIORAL ECONOMICS AND EMPIRICAL PUBLIC POLICY
Time-to-Digital Converter With 2.1-ps RMS Single-Shot Precision and Subpicosecond Long-Term and Temperature Stability