Instruct: Given the title of a paper, retrieve paper titles that are cited by the given paper.
Query: High-Performance Back-Illuminated Three-Dimensional Stacked Single-Photon Avalanche Diode Implemented in 45-nm CMOS Technology
Backside illuminated SPAD image sensor with 7.83μm pitch in 3D-stacked CMOS technology
A 45nm 4Gb 3-Dimensional Double-Stacked Multi-Level NAND Flash Memory with Shared Bitline Structure
32 × 32 CMOS SPAD Imager for Gated Imaging, Photon Timing, and Photon Coincidence
A CMOS-compatible silicon photonic platform for high-speed integrated opto-electronics
Vertical integration after stacking (ViaS) process for low-cost and low-stress 3D silicon integration
Suppression of crosstalk by using backside deep trench isolation for 1.12μm backside illuminated CMOS image sensor
Vertical-channel stacked array (VCSTAR) for 3D NAND flash memory
Device Characteristics of Single-Gate Vertical Channel (SGVC) 3D NAND Flash Architecture
Overview of 3D NAND Flash and progress of split-page 3D vertical gate (3DVG) NAND architecture
A Bottom-Source Single-Gate Vertical Channel (BS-SGVC) 3D NAND Flash Architecture and Studies of Bottom Source Engineering
A 0.66erms− Temporal-Readout-Noise 3-D-Stacked CMOS Image Sensor With Conditional Correlated Multiple Sampling Technique
Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors
100 000 Frames/s 64 × 32 Single-Photon Detector Array for 2-D Imaging and 3-D Ranging
A larger stacked layer number scalable TSV-based 3D-SRAM for high-performance universal-memory-capacity 3D-IC platforms
Silicon Photonic Integration Platform—Have We Found the Sweet Spot?
Hybrid Silicon Photonic Integrated Circuit Technology
Three-Dimensional nand Flash Architecture Design Based on Single-Crystalline STacked ARray
Metal-Insulator-Semiconductor Photodetectors
Gated three-terminal device architecture to eliminate persistent photoconductivity in oxide semiconductor photosensor arrays
A critical examination of 3D stackable NAND Flash memory architectures by simulation study of the scaling capability
A comparative study of image classification algorithms for Foraminifera identification
A modified Covariance Matrix Adaptation Evolution Strategy with adaptive penalty function and restart for constrained optimization
Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors
Exposure Fusion: A Simple and Practical Alternative to High Dynamic Range Photography
Protecting privacy using the decentralized label model