Instruct: Given the title of a scientific paper, retrieve paper titles that are cited by the given paper
Query: Bonding 1200 V, 150 A IGBT chips (13.5 mm × 13.5 mm) with DBC substrate by pressureless sintering nanosilver paste for power electronic packaging
Simplification of the Nanosilver Sintering Process for Large-Area Semiconductor Chip Bonding: Reduction of Hot-Pressing Temperature Below 200/spl deg/C
Electro-thermal-mechanical modeling of wire bonding failures in IGBT
A New Isolation Technique for Reverse Blocking IGBT with Ion Implantation and Laser Annealing to Tapered Chip Edge Sidewalls
Development of packaging technologies for SiC power module
Nano-Function Paste for power semiconductors
Recent developments of direct bonded copper (DBC) substrates for power modules
Effects of Bonding Parameters on the Reliability of Fine-Pitch Cu/Ni/SnAg Micro-Bump Chip-to-Chip Interconnection for Three-Dimensional Chip Stacking
Thermal Management on IGBT Power Electronic Devices and Modules
Direct Bond Interconnect (DBI®) for fine-pitch bonding in 3D and 2.5D integrated circuits
Thermal and Electrical Performance of Direct Bond Interconnect Technology for 2.5D and 3D Integrated Circuits
Ionized physical vapor deposition of integrated circuit interconnects*
Thermo-Compression Bonding for fine-pitch copper-pillar flip-chip interconnect - tool features as enablers of unique technology
Improving the power cycling performance of the emitter contact of IGBT modules: Implementation and evaluation of stitch bond layouts
Challenges of flip chip packaging with embedded fine line and multi-layer coreless substrate
Localized induction heating solder bonding for wafer level MEMS packaging
Advances in Wire Bonding Technology for 3D Die Stacking and Fan Out Wafer Level Package
600 V Reverse Conducting (RC-)IGBT for Drives Applications in Ultra-Thin Wafer Technology
Design and Fabrication of Integrated Power Inductor Based on Silicon Molding Technology
Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package
Pick-and-Place Silver Sintering Die Attach of Small-Area Chips
Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips
A peridynamic perspective on spring-mass fracture
A Quasicrystalline Language of “Primitive Units of Consciousness” in Quantized Spacetime
Smartphone-based Home Robotics
Multi-sphere Support Vector Data Description for Outliers Detection on Multi-distribution Data