Instruct: Given the title of a scientific paper, retrieve paper titles that are cited by the given paper
Query: A Novel Modular Design and Modeling Methodology for High Speed High Density Die Package PCB Co-Simulation and Model Library Creation
Parameterized models for a RF chip-to-substrate interconnect
Electromagnetic Modeling of Through-Silicon Via (TSV) Interconnections Using Cylindrical Modal Basis Functions
High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications
An event-driven simulation methodology for integrated switching power supplies in SystemVerilog
Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package
Design and Reliability in Wafer Level Packaging
Development of Simulink-based SiC MOSFET modeling platform for series connected devices
High Density Through Wafer Via Technology
Fan-Out Wafer-Level Packaging with highly flexible design capabilities
Embedded System Design: Modeling, Synthesis and Verification
High-level synthesis with LegUp: a crash course for users and researchers
Handbook of Algorithms for Physical Design Automation
Architecting Microprocessor Components in 3D Design Space
Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs
Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging
Thermal analysis of a 3D die-stacked high-performance microprocessor
ESD Design Strategies for High-Speed Digital and RF Circuits in Deeply Scaled Silicon Technologies
Feasibility of single wire communication for PCB-level interconnects
A circuit model of electrostatic discharge generators for ESD and EMC SPICE simulation
Using ultra-low parasitic hybrid packaging method to reduce high frequency EMI noise for SiC power module
High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes
Renoprotective effects of febuxostat compared with allopurinol in patients with hyperuricemia: A systematic review and meta-analysis
EEG and MEG Data Analysis in SPM8
Applicability of RF-based methods for emotion recognition: A survey
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