Instruct: Given a scientific paper title, retrieve paper titles that are cited by the given paper.
Query: Low-Loss 3-D Multilayer Transmission Lines and Interconnects Fabricated by Additive Manufacturing Technologies
High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications
High Density Through Wafer Via Technology
Additive Manufacturing Technologies : 3 D Printing , Rapid Prototyping , and Direct Digital Manufacturing ”
A broadband 3D vertical Microstrip to Stripline transition in LTCC using a quasi-coaxial structure for millimetre-wave SOP applications
Design of lattice structure for additive manufacturing
Metal Additive Manufacturing: A Review
Through-package-via formation and metallization of glass interposers
Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package
3D-IC interconnect test, diagnosis, and repair
Ultrathin glass wafer lamination and laser debonding to enable glass interposer fabrication
Hybrid bonding of Cu/Sn microbump and adhesive with silica filler for 3D interconnection of single micron pitch
Ionized physical vapor deposition of integrated circuit interconnects*
3D-printed low-cost, low-loss microwave components up to 40 GHz
A novel double layer NCF for highly reliable micro-bump interconnection
Modeling and analysis of nonuniform substrate temperature effects on global ULSI interconnects
A Practical Method for Modeling PCB Transmission Lines with Conductor Surface Roughness and Wideband Dielectric Properties
Wafer level packaging (WLP): Fan-in, fan-out and three-dimensional integration
Through silicon via technology — processes and reliability for wafer-level 3D system integration
Challenges of flip chip packaging with embedded fine line and multi-layer coreless substrate
Modeling, design, fabrication and characterization of first large 2.5D glass interposer as a superior alternative to silicon and organic interposers at 50 micron bump pitch
relationships between contraception and abortion : a review of the evidence .
A broadband 3D vertical Microstrip to Stripline transition in LTCC using a quasi-coaxial structure for millimetre-wave SOP applications
Fabrication and Characteristics of Reduced Graphene Oxide Produced with Different Green Reductants
Watch, Listen, and Describe: Globally and Locally Aligned Cross-Modal Attentions for Video Captioning
A Roadmap for the Value-Loading Problem.