Instruct: Given a scientific paper title, retrieve paper titles that are cited by the given paper.
Query: Reliability of hybrid bond interconnects
Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding
Reliability of dual-damascene local interconnects featuring cobalt on 10 nm logic technology
Development of Next Generation Flip Chip Interconnection Technology Using Homogenized Laser-Assisted Bonding
Cu-Cu hybrid bonding as option for 3D IC stacking
Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds
Fan-Out Chip on Substrate Device Interconnection Reliability Analysis
Ruthenium interconnect resistivity and reliability at 48 nm pitch
An evaluation of test structures for measuring the contact resistance of 3-D bonded interconnects
A novel double layer NCF for highly reliable micro-bump interconnection
Chip package interaction (CPI) reliability of Cu/low-k/ultra-low-k interconnect
Accelerated SLID bonding using thin multi-layer copper-solder stack for fine-pitch interconnections
Reliability study of Au-In transient liquid phase bonding for SiC power semiconductor packaging
Building-in reliability in BCD (Bipolar-CMOS-DMOS) technologies
Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies
A hybrid SoC interconnect with dynamic TDMA-based transaction-less buses and on-chip networks
Pre-bond testing of the silicon interposer in 2.5D ICs
Reliability of copper wire bonding in humidity environment
Cu/BCB hybrid bonding with TSV for 3D integration by using fly cutting technology
Interconnect characteristics of 2.5-D system integration scheme
A Reliability Model for Various Switch Designs in Hybrid Redundancy
Improving Intelligence Analysis With Decision Science.
Hands in Space: Gesture Interaction with Augmented-Reality Interfaces
Fundamental limits of latency in a cache-aided 4×4 interference channel
High dynamic range imaging: spatially varying pixel exposures
Digital Image Watermarking in the Wavelet Transform Domain