Instruct: Given a paper title, retrieve paper titles that are cited by the given paper
Query: Embedded wafer level ball grid array (eWLB) technology for high-frequency system-in-package applications
Embedded wafer level ball grid array (eWLB) technology for millimeter-wave applications
Wafer level packaging (WLP): Fan-in, fan-out and three-dimensional integration
Board level reliability of automotive eWLB (embedded wafer level BGA) FOWLP
Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration
High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration
System in wafer-level package technology with RDL-first process
Fan-Out Wafer-Level Packaging with highly flexible design capabilities
Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging
Array antenna integrated fan-out wafer level packaging (InFO-WLP) for millimeter wave system applications
High performance passive devices for millimeter wave system integration on integrated fan-out (InFO) wafer level packaging technology
A chip-scale packaging technology for 60-GHz wireless chipsets
Design and Reliability in Wafer Level Packaging
Development of Novel High Density System Integration Solutions in FOWLP-Complex and Thin Wafer-Level SiP and Wafer-Level 3D Packages
Power saving and noise reduction of 28nm CMOS RF system integration using integrated fan-out wafer level packaging (InFO-WLP) technology
Board level temperature cycling study of large array Wafer Level Package
The impact of embedded wafer level BGA package on the antenna performance
Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Redistributed Layers
Opportunities of Fan-out Wafer Level Packaging (FOWLP) for RF applications
Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications
Integration of MEMS/Sensors in Fan-Out wafer-level packaging technology based system-in-package (WLSiP)
Neural Fuzzy Systems: A Neuro-Fuzzy Synergism to Intelligent Systems [Book review]
A 60 GHz same-channel full-duplex CMOS transceiver and link based on reconfigurable polarization-based antenna cancellation
Exemplar Encoder-Decoder for Neural Conversation Generation
A 77-GHz FMCW MIMO Radar Based on an SiGe Single-Chip Transceiver
Local Indicators of Spatial Association