Instruct: Given a paper title, retrieve paper titles that are cited by the given paper
Query: Laser grooving profile optimization for chip strength enhancement
Single & multi beam laser grooving process parameter development and die strength characterization for 40nm node low-K/ULK wafer
Debris-free in-air laser dicing for multi-layer MEMS by perforated internal transformation and thermally-induced crack propagation
A new approach to wafer sawing: stealth laser dicing technology
Improved grayscale lithography
Stiction in surface micromachining
Evaluation for UV laser dicing process and its reliability for various designs of stack chip scale package
A Scratch Intersection Model of Material Removal During Chemical Mechanical Planarization (CMP)
Laser curing of inkjet printed strain gauge structures
Multi-photon absorption enhancement by dual-wavelength double-pulse laser irradiation for efficient dicing of sapphire wafers
Low-Temperature Bonding of Laser Diode Chips on Silicon Substrates Using Plasma Activation of Au Films
The Optimization of Surface Roughness of Al 6061 using Taguchi Method in Ball Burnishing Process
A Fast Correction Algorithm for Laser Marking Based on SOPC Technology
Using Taguchi method to optimize welding pool of dissimilar laser-welded components
Thin Silicon Wafer Device Concept with Advanced Laser Annealing and Sintering Process
Embedded Trench Redistribution Layers (RDL) by Excimer Laser Ablation and Surface Planer Processes
Non-uniformity of wafer and pad in CMP: kinematic aspects of view
The Mechanics of Machining at the Microscale : Assessment of the Current State of the Science
Current State and Prospect of Micro-Machining
Laser voltage imaging and probing, efficient techniques for scan chain verification in advanced node
Patterning and Electronic Tuning of Laser Scribed Graphene for Flexible All-Carbon Devices
Modeling Color Difference for Visualization Design
Confidence intervals for standardized effect sizes: Theory, application, and implementation
Development of an Implicit Overall Well-Being Measure Using the Implicit Association Test
Experimental observations of dry powder inhaler dose fluidisation.
300mm low k wafer dicing saw study