Instruct: Given the title of a scientific paper, retrieve paper titles that are cited by the given paper.
Query: Investigation of Production Quality and Reliability Risk of ELK Wafer WLCSP Package
Challenges of Ultra-Thin 5 Sides Molded WLCSP
Impact of probing procedure on flip chip reliability
Chip-packaging interaction: a critical concern for Cu/low k packaging
Studies on the Thermal Cycling Reliability of BGA System-in-Package (SiP) With an Embedded Die
Low cost flip chip (LCFC): An innovative approach for breakthrough reduction in flip chip package cost
Chip package interaction (CPI) reliability of Cu/low-k/ultra-low-k interconnect
Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration
Comprehensive Investigation of Die Shift in Compression Molding Process for 12 Inch Fan-Out Wafer Level Packaging
Through silicon via technology — processes and reliability for wafer-level 3D system integration
Fan-out wafer-level packaging for 3D IC heterogeneous integration
Opportunities of Fan-out Wafer Level Packaging (FOWLP) for RF applications
SOLDER JOINT RELIABILITY ANALYSIS AND TESTING OF A DUAL ROW QFN PACKAGE
Liquid crystal polymer (LCP) for microwave/millimeter wave multilayer packaging
Wafer edge defect study of temporary bonded and thin wafers in TSV process flow
Silicon Interposer Warpage Study for 2.5D IC without TSV Utilizing Glass Carrier CTE and Passivation Thickness Tuning
Solder extrusions and underfill delaminations: a remarkable Flip Chip qualification experience
Development of Novel High Density System Integration Solutions in FOWLP-Complex and Thin Wafer-Level SiP and Wafer-Level 3D Packages
Reliability in MEMS Packaging
Investigation on seal-ring rules for IC product reliability in 0.25-mum CMOS technology
Power saving and noise reduction of 28nm CMOS RF system integration using integrated fan-out wafer level packaging (InFO-WLP) technology
Classification and treatment of the anterior maxillary dentition affected by dental erosion: the ACE classification.
Novel wafer dicing and chip thinning technologies realizing high chip strength
Spectrum of mutations in Glutaryl-CoA dehydrogenase gene in glutaric aciduria type I – Study from South India
Physical Activity, Affect, and Cognition in Children With Symptoms of ADHD:
Epigenetics and plant evolution