Instruct: Given the title of a paper, retrieve paper titles that are cited by the given paper.
Query: Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability
Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors
Pre-bond testing of the silicon interposer in 2.5D ICs
Cobalt interconnect on same copper barrier process integration at the 7nm node
Modeling, design and demonstration of low-temperature, low-pressure and high-throughput thermocompression bonding of copper interconnections without solders
Nanoparticle assembly and sintering towards all-copper flip chip interconnects
Cu/Sn SLID wafer-level bonding optimization
Vertical integration after stacking (ViaS) process for low-cost and low-stress 3D silicon integration
Reliability of Cu pillar bump for flip chip and 3-D SiP
A novel double layer NCF for highly reliable micro-bump interconnection
Metal lift failure modes during fine pitch wire bonding low-k devices with Bond Over Active (BOA) design
Multi-chip gang bonding technology using the thermo-compression bonder for Si substrate
Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)
Ionized physical vapor deposition of integrated circuit interconnects*
Novel wafer dicing and chip thinning technologies realizing high chip strength
Development of next-generation system-on-package ( SOP ) technology based on silicon carriers with fine-pitch chip interconnection
CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration
Low-k interconnect stack with a novel self-aligned via patterning process for 32nm high volume manufacturing
Low-Pressure-Assisted Large-Area (>800 mm2) Sintered-Silver Bonding for High-Power Electronic Packaging
Design and Reliability in Wafer Level Packaging
An evaluation of test structures for measuring the contact resistance of 3-D bonded interconnects
An Adaptive Compensation Algorithm for Temperature Drift of Micro-Electro-Mechanical Systems Gyroscopes Using a Strong Tracking Kalman Filter
Comparison Between Dual-Energy Computed Tomography and Ultrasound in the Diagnosis of Gout of Various Joints.
Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding
Mapping crop water stress index in a ‘Pinot-noir’ vineyard: comparing ground measurements with thermal remote sensing imagery from an unmanned aerial vehicle
Diverse Beam Search: Decoding Diverse Solutions from Neural Sequence Models