Instruct: Given the title of a scientific paper, retrieve paper titles that are cited by the given paper
Query: Signal and Power Integrity Analysis on Integrated Fan-Out PoP (InFO_PoP) Technology for Next Generation Mobile Applications
High performance passive devices for millimeter wave system integration on integrated fan-out (InFO) wafer level packaging technology
Power distribution networks for system-on-package: status and challenges
Power Integrity Analysis of a 28 nm Dual-Core ARM Cortex-A57 Cluster Using an All-Digital Power Delivery Monitor
Warpage Simulation and Optimization of Fan-Out Wafer level Package(FO-WLP) with TMV under Different Processes
Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Redistributed Layers
Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging
Routing track duplication with fine-grained power-gating for FPGA interconnect power reduction
Fan-Out Wafer-Level Packaging with highly flexible design capabilities
Fan-out wafer-level packaging for 3D IC heterogeneous integration
Molding process development for high density I/Os Fan-Out Wafer Level Package (FOWLP) with fine pitch RDL
A New Power Management IC Architecture for Envelope Tracking Power Amplifier
A development of Fractal PIFA (planar inverted F antenna) with bandwidth enhancement for mobile phone applications
Optimal Power/Performance Pipeline Depth for SMT in Scaled Technologies
Ultra Fine Pitch / Low Cost FCCSP Package and Chip Package Interaction (CPI) for Advanced CMOS Nodes
Design of Broadband Linear and Efficient Power Amplifier for Long-Term Evolution Applications
Revisiting 802.11 power consumption modeling in smartphones
A unique failure mechanism induced by chip to board interaction on fan-out wafer level package
Power-aware communication optimization for networks-on-chips with voltage scalable links
Silicon Photonic Integration Platform—Have We Found the Sweet Spot?
Development and characterization of new generation panel fan-out (P-FO) packaging technology
frequency domain system identification for a small , low - cost , fixed - wing uav .
Effects of Sedative Interruption in Critically Ill, Mechanically Ventilated Patients Receiving Midazolam or Propofol
People on drugs: credibility of user statements in health communities
Computational higher-dimensional type theory
A 60-GHz Millimeter-wave CMOS Marchand Balun