Instruct: Given the title of a paper, retrieve paper titles that are cited by the given paper
Query: Transient Liquid Phase Sintering Using Copper-Solder-Resin Composite for High-Temperature Power Modules
Cu@Sn Core–Shell Structure Powder Preform for High-Temperature Applications Based on Transient Liquid Phase Bonding
Localized induction heating solder bonding for wafer level MEMS packaging
Thermal Cycling Reliability of Lead-Free Solders (SAC305 and Sn3.5Ag) for High-Temperature Applications
Reliability of Silver Sintering on DBC and DBA Substrates for Power Electronic Applications
Nanoparticle assembly and sintering towards all-copper flip chip interconnects
Friction stir welding (FSW) process of copper alloys
Development of packaging technologies for SiC power module
Description of the thermo-mechanical properties of a Sn-based solder alloy by a unified viscoplastic material model for Finite Element calculations
Thermo-Compression Bonding for fine-pitch copper-pillar flip-chip interconnect - tool features as enablers of unique technology
Recent developments of direct bonded copper (DBC) substrates for power modules
Advanced Thermal Management Solutions on PCBs for High Power Applications
Reliability Study on Copper Pillar Bumping with Lead Free Solder
Plasma reflow bumping of Sn-3.5 Ag solder for flux-free flip chip package application
High density Cu-Sn TLP bonding for 3D integration
Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding
Low temperature Cu-Cu direct bonding for 3D-IC by using fine crystal layer
Thermo-compression bonding for 2.5D fine pitch copper pillar bump interconnections on TSV interposer
The Novel Liquid Molding Compound for Fan-out Wafer Level Package
A viscoplastic-fatigue-creep damage model for tin-based solder alloy
Thin-Wafer Silicon IGBT With Advanced Laser Annealing and Sintering Process
Survey on High-Temperature Packaging Materials for SiC-Based Power Electronics Modules
Blind Image Deconvolution using Deep Generative Priors
Getting More Out Of Syntax with PropS
moving target indication via radarsat - 2 multichannel synthetic aperture radar processing .
An implementation of the contract net protocol based on marginal cost calculations