Instruct: Given a paper title, retrieve paper titles that are cited by the given paper.
Query: Interposer Technologies for High-Performance Applications
Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect
Advances in embedded traces for 1.5µm RDL on 2.5D glass interposers
Molding process development for high density I/Os Fan-Out Wafer Level Package (FOWLP) with fine pitch RDL
Thermo-Compression Bonding for fine-pitch copper-pillar flip-chip interconnect - tool features as enablers of unique technology
Via-in-Trench: A Revolutionary Panel-Based Package RDL Configuration Capable of 200-450 IO/mm/Layer, an Innovation for More-Than-Moore System Integration
BIST for network-on-chip interconnect infrastructures
1-Gb/s 80-dB/spl Omega/ fully differential CMOS transimpedance amplifier in multichip on oxide technology for optical interconnects
Wafer-level bonding/stacking technology for 3D integration
Fully aligned via integration for extendibility of interconnects to beyond the 7 nm node
An 800 volts high voltage interconnection level shifter using Floating Poly Field Plate (FPFP) method
DesignCon 2012 Design and Characterization of the Power Supply System for a High Speed 1600 Mbps DDR 3 Interface in Wirebond Package
Ruthenium interconnect resistivity and reliability at 48 nm pitch
A low latency router supporting adaptivity for on-chip interconnects
A High-Performance Hierarchical Ring On-Chip Interconnect with Low-Cost Routers
Terabit/sec-class board-level optical interconnects through polymer waveguides using 24-channel bidirectional transceiver modules
Mitigation of warpage for large 2.5D Through Silicon Interposer (TSI) package assembly
Fan-Out Wafer-Level Packaging with highly flexible design capabilities
Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding
Demonstration of 3–5 μm RDL line lithography on panel-based glass interposers
iPipe : A Framework for Building Datacenter Applications Using In-networking Processors
Terabit/s-Class Optical PCB Links Incorporating 360-Gb/s Bidirectional 850 nm Parallel Optical Transceivers
Next-Generation DNA Sequencing Methods
Burstiness of Verbs and Derived Nouns
Error patterns on the Raven's Standard Progressive Matrices Test
Trajectories as Topics: Multi-Object Tracking by Topic Discovery