Instruct: Given a scientific paper title, retrieve paper titles that are cited by the given paper
Query: Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) Package Trends and Reliability
Package characterization on advanced NBA-QFN structure
Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs)
Characterization of Printed Circuit Board Material & Manufacturing Technology for High Frequency AT & S Leoben , Austria
copper pillar shape and related stress simulation studies in flip chip packages .
The Novel Liquid Molding Compound for Fan-out Wafer Level Package
Warpage characterization of panel Fan-out (P-FO) package
Issues in fatigue life prediction model for underfilled flip chip bump
Advanced coreless flip-chip BGA package with high dielectric constant thin film embedded decoupling capacitor
From fan-out wafer to fan-out panel level packaging
Effects of Bonding Parameters on the Reliability of Fine-Pitch Cu/Ni/SnAg Micro-Bump Chip-to-Chip Interconnection for Three-Dimensional Chip Stacking
Development of Mechanical Locking Micro-Anchor Structures for aQFN Package Application
Failure Mechanism and Solution Study of IC Wire Bond Heel Crack on Leadframe
Integrated circuit testing for quality assurance in manufacturing: history, current status, and future trends
Advanced flip chip package on package technology for mobile applications
Investigating Printed Circuit Board shrinkage during reflow soldering
Effect of UBM and BCB layers on the thermo-mechanical reliability of wafer level chip scale package (WLCSP)
Thermal Cycling Reliability of Chip Resistor Lead Free Solder Joints
High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications
Board level temperature cycling study of large array Wafer Level Package
High performance passive devices for millimeter wave system integration on integrated fan-out (InFO) wafer level packaging technology
A Novel Method for LiDAR Camera Calibration by Plane Fitting
Cognitive and Linguistic Processing in the Bilingual Mind
Practical Secure Aggregation for Privacy-Preserving Machine Learning
Machine Learning in Bioinformatics
SOLDER JOINT RELIABILITY ANALYSIS AND TESTING OF A DUAL ROW QFN PACKAGE