Instruct: Given a paper title, retrieve paper titles that are cited by the given paper
Query: Simulation of micro-bump interconnections failure analysis for 2.5D IC packaging
Effects of Bonding Parameters on the Reliability of Fine-Pitch Cu/Ni/SnAg Micro-Bump Chip-to-Chip Interconnection for Three-Dimensional Chip Stacking
Thermal and Electrical Performance of Direct Bond Interconnect Technology for 2.5D and 3D Integrated Circuits
Warpage Prediction and Experiments of Fan-Out Waferlevel Package During Encapsulation Process
Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Redistributed Layers
Failure Mechanism and Solution Study of IC Wire Bond Heel Crack on Leadframe
Fan-Out Chip on Substrate Device Interconnection Reliability Analysis
SOLDER JOINT RELIABILITY ANALYSIS AND TESTING OF A DUAL ROW QFN PACKAGE
Simulation of bulk current injection test using integrated circuit immunity macro model and electromagnetic analysis
Simulation techniques for EMC compliant design of automotive IC chips and modules
Chip-to-Wafer (C2W) flip chip bonding for 2.5D high density interconnection on TSV free interposer
Analysis of electromigration for Cu pillar bump in flip chip package
Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging
Impact of probing procedure on flip chip reliability
Assembly process and reliability assessment of TSV/RDL/IPD interposer with multi-chip-stacking for 3D IC integration SiP
A Novel Modular Design and Modeling Methodology for High Speed High Density Die Package PCB Co-Simulation and Model Library Creation
Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)
Hybrid bonding of Cu/Sn microbump and adhesive with silica filler for 3D interconnection of single micron pitch
Studies on the Thermal Cycling Reliability of BGA System-in-Package (SiP) With an Embedded Die
Fan-out wafer-level packaging for 3D IC heterogeneous integration
Wire bonding, bumping & assembly related failures & improvements
A convolutional neural network for pedestrian gender recognition
Primary Melanoma With Multiple Skin Metastases
proceedings of the genetic and evolutionary computation conference companion , gecco 2018 , kyoto , japan , july 15 - 19 , 2018 .
High density Cu-Sn TLP bonding for 3D integration
Intuitive experimentation in the physical world