Instruct: Given a paper title, retrieve paper titles that are cited by the given paper
Query: Cu-Sn based die attach material for power semiconductor with stress control
Die Attach Material for Power Semiconductor Having Nano-Level Sn-Cu Diffusion Control
Hybrid bonding of Cu/Sn microbump and adhesive with silica filler for 3D interconnection of single micron pitch
Reliability evaluation of copper (Cu) through-silicon via (TSV) barrier and dielectric liner by electrical characterization
Low-Pressure-Assisted Large-Area (>800 mm2) Sintered-Silver Bonding for High-Power Electronic Packaging
Cu/Sn SLID wafer-level bonding optimization
Material characterization of a novel lead-free solder material — SACQ
Lead delamination correlation with Sn layer melting during sawing in power QFN package
Effects of Bonding Parameters on the Reliability of Fine-Pitch Cu/Ni/SnAg Micro-Bump Chip-to-Chip Interconnection for Three-Dimensional Chip Stacking
Critical interlayer thickness for transient liquid phase bonding in the Cu–Sn system
Reliability of Silver Sintering on DBC and DBA Substrates for Power Electronic Applications
Pick-and-Place Silver Sintering Die Attach of Small-Area Chips
Interface degradation of Al heavy wire bonds on power semiconductors during active power cycling measured by the shear test
Survey on High-Temperature Packaging Materials for SiC-Based Power Electronics Modules
Low temperature Cu-Cu direct bonding for 3D-IC by using fine crystal layer
Wafer-level Cu-Cu bonding technology
Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering
New die attach adhesives enable low-stress MEMS packaging
Ultra-fine pitch Cu-Cu bonding of 6μm bump pitch for 2.5D application
Effect of Die Size and Die Tilt on Solder Reliability under Thermal Cycling
Development and electrical investigation of novel fine-pitch Cu/Sn pad bumping using ultra- thin buffer layer technique in 3D integration
Pre- and postoperative management techniques. Before and after. Part 2: the removal of third molars
Accelerated SLID bonding using thin multi-layer copper-solder stack for fine-pitch interconnections
The teacher's role in promoting collaborative dialogue in the classroom.
Dynamic load balancing on single- and multi-GPU systems
development in down syndrome .